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Diamond cutting wire
Diamond cutting wire is a new product by our own research and development. The quality of product has reached the world leading level. Products are used in cutting supplies supporting the manual, in-line, multi-wire cutting machines, it can replace the cutting process of light abrasive. For precise cutting various types of artificial crystal, ceramic, quartz glass, monocrystalline silicon, polycrystalline silicon, sapphire and special metal materials and so on.
Technical parameters:
1.Diameter: 0.06 to 0.36mm, diameter deviation ≤ 0.01mm
2.Bus Material: high strength steel wire cutting
3.Grit size of diamond: 5μm to 60μm, we can design according to the customer's requirements
4.The tensile strength: 3200 to 3400Mpa
5.Wire length: we can processing according to user's requirements
|
Wire specifications(mm) |
Allow diameter deviation |
Germ-wire diameter |
Diamond specifications |
Breaking Rally(N) |
Suitable for cutting the object |
|
0.12 |
0.005 |
0.10 |
5-10 |
≥25 |
Silicon slice |
|
0.13 |
0.005 |
0.11 |
5-10 |
≥30 |
Silicon slice |
|
0.14 |
0.01 |
0.11 |
10-15 |
≥30 |
Silicon slice |
|
0.16 |
0.01 |
0.13 |
10-15 |
≥45 |
Crystal Slice |
|
0.24 |
0.01 |
0.16 |
30-40 |
≥72 |
Ceramics、sapphire cutting |
|
0.26 |
0.01 |
0.18 |
30-40 |
≥85 |
sapphire cutting |
|
0.30 |
0.01 |
0.20 |
40-50 |
≥95 |
Silicon prescribing、cut off |
|
0.34 |
0.01 |
0.25 |
40-50 |
≥150 |
Silicon prescribing、cut off |
|
0.36 |
0.01 |
0.27 |
40-50 |
≥180 |
Silicon prescribing、cut off |